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3DXSTAT™ ESD PC 3D Printing Filament

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  • ESD-Safe PC Filament
  • ESD Polycarbonate Filament
  • 3D Printed Conformal Coating Mask Jig
  • 3D Printed Conformal Coating Mask Jig
  • 3D Printed Conformal Coating Mask Jig
  • ESD-Safe PC Filament
  • 3DXSTAT™ ESD Wafer Carrier
  • 3DXSTAT™ ESD Wafer Carrier
  • CNT

 Product Description

3DXSTAT™ ESD-Safe Polycarbonate (PC) Filament

Our unique ESD-Safe Polycarbonate (PC) is ideal for ESD applications where improved thermal, mechanical, and dimensional stability is needed.  

3DXSTAT™ ESD PC is an advanced ESD-Safe compound designed for use in critical applications that require electrostatic discharge (ESD) protection and a high level of cleanliness.  Manufactured with consistency in mind - 3DXTech starts with premium polycarbonate resin and then compounded according to a proprietary formulation of carbon additives and process / dispersion modifiers - giving you a filament with excellent printing characteristics and consistent ESD properties.

Benefits of Polycarbonate include:

  • High Thermal Properties: 147°C Tg
  • Amorphous:  Low and near isotropic shrinkage
  • Excellent ductility / impact resistance
  • Very low odor emitted during printing
  • Wide processing range:  265 - 300°C (Max)

Benefits of 3DXSTAT™ include:

  • Consistent surface resistivity
  • Improved retention of impact & elongation
  • Low particulate contamination
  • Minimal contribution to outgassing and ionic contamination

Typical applications include:

  • Semi-con:  HDD Components, Wafer Handling, Jigs, Casings, & Connectors 
  • Industrial:  Conveying, Metering, and Sensing applications

Target conductivity for 3DXSTAT™ ESD Polycarbonate: 

  • 10^6 to 10^9 ohm surface resistivity on 3DP sample using concentric ring test method.  
  • Note:  Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity.  Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry.  Therefore, expect some trial time to understand how this filament works in your specific printer / application.  

Recommended Print Conditions:

  • Extruder:  Between 260 and 300°C depending on your printer / extruder.  Ideal layer bonding is typically possible at 275 - 280°C.  
  • Platform Temp:  110 - 120°C
  • Platform Prep:  Kapton Polyimide w/ ABS Acetone Slurry coating
  • PC absorbs moisture from the environment, therefore it is important to keep this filament dry between uses.  You will see bubbles / hear popping if the PC gets wet.  If this happens, dry the filament in a small oven at 150°F for 3-4 hours.  Note, the typical drying temperature for PC is 120°C (not F), but the reel that the filament is supplied on will fail at 120°C.  Therefore, do not dry the filament at this temperature unless you remove the length you want to print with from the reel.   

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