3DXSTAT ESD PC

3DXSTAT™ ESD-Safe Polycarbonate (ESD PC) 3D Printing Filament

3DXSTAT™ ESD PC is an advanced ESD-Safe compound designed for use in critical applications which require electrostatic discharge (ESD) protection. Made using cutting-edge multi-wall carbon nanotube technology, state of the art compounding technology, and precision extrusion processes. Target surface resistance of 10^7 to 10^9 Ohm.

Gearbox HT2™ 3D Printer:

Print industrial-grade parts using our ESD PC and more with the new Gearbox™ HT2 High-Temp 3D Printer.

Extruder Temp
260-300°C

Bed Temp
110-120°C

Heated Chamber
Recommended

Nozzle Specs
No special concerns

Bed Adhesion
Magigoo Bed Prep
Polyimide Tape

Layer Height
No special concerns

Drying Specs
120°C for 4 hours

Supports
Water Soluble Support

Technical Data Sheet

Click to open this material’s TDS.

Safety Data Sheet

Click to open this material’s SDS.

Typical ESD PC Applications Include:

• Semi-con: HDD Components, Wafer Handling, Jigs, Casings, & Connectors
• Industrial: Conveying, Metering, and Sensing Applications

Target Conductivity for 3DXSTAT ESD PC:

• 10^7 to 10^9 ohm surface resistivity on 3DP sample using concentric ring test method.
• Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently, not to mention varied part geometry. Therefore, expect some trial time to understand how ESD PC filament works in your specific printer and application.

Surface Conductivity as a Function of Extruder Temperature:

The surface resistance of the printed ESD PC part will vary depending on the printer’s extruder temperature. For example, if your testing indicates the part is too insulative, then increasing the extruder temperature will result in improved conductivity. Therefore, the surface resistance can be ‘dialed-in’ by adjusting the extruder temperature up or down depending on the reading you receive on your part.

Filament Specifications:

1.75mm and 2.85mm +/- 0.05mm in diameter

Recommended Print Settings:

• Extruder: 260-300°C
• Bed Temp: 110-120°C
• Bed Prep: Magigoo Bed Prep or 3DXTECH Polyimide Tape gives us the best results
• Heated Chamber: Recommended, a chamber helps reduce warping and improves layer adhesion
• Supports: AquaTek™ water soluble X1 USM Universal Support Material works ideal for complex parts
• Drying Instructions: 120°C for 4 hours.